B2B in TSMC Turnkey Service

Symposium:	ISSM 2001
Paper Title:	B2B in TSMC Turnkey Service
Date:	Oct 8-10, 2001
Place:	San Jose, U.S.A.
Authors:	Dennys Sung-Ting Hsieh, Jason Jengkuen Lu, Eric Cheng-Chin Feng, Ivan Hsin-Wan Hsu
Abstract:	In order to improve foundry-services quality and save customers time and money. TSMC provide an easy Internet solution to help customers. The systems will offer these data from wafer parameter, assembly, final test and etc. The in-situ data, process flow, target deliver time and deliver logistic could be done by these systems, too. With it, customer will fell very easily and seamless between several subcontractors.
Paper:	B2B in TSMC Turnkey Service (PDF, 104K, English)
Slide:	B2B in TSMC Turnkey Service (PDF, 517K, English)
Reference:	ISSM official site.

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